A compact 3-zone conveyor reflow oven designed for reliable solder reflow and small-to-medium production runs, with touchscreen control and hot-air convection across the PCB.
Designed for repeatable inline production with independent zone temperature control, touchscreen operation and thermal profiling support.
The AE-F600C uses three independently controlled heating zones to support controlled ramp, soak, reflow and cooling behavior for compact production runs. Closed-loop control manages each zone across the thermal profile.
Its airflow design uses centered slots and pressurized multi-hole airflow to distribute heat with low turbulence. Low-velocity convection helps reduce component disturbance, while the zone architecture is designed to minimize interference between heating sections.
This section is ready for the AE-F600C YouTube video when available.
| Model | AE-F600C |
|---|---|
| Type | 3-zone convection reflow oven |
| Heating zones | 3 independent zones |
| Maximum temperature | Up to 300°C |
| Temperature control | ±2°C closed-loop |
| Board uniformity | Approx. ±2°C across PCB |
| Power supply | 220 V × 3 phase |
| Optional power | 1 phase available |
| Operating power | Approx. 12.5 kW |
| Maximum PCB width | 10 in |
| Dimensions | 79 × 32 × 50 in |
| Packing size | 84 × 32 × 58 in |
| Control | Windows-based touchscreen operation |
| Thermal profiling | Built-in profiler; supports 2 to 3 inline thermal couplers |
Send us your PCB width, solder paste requirements, available power and expected production volume. We can help confirm whether the AE-F600C fits your process.
