The largest tabletop oven in the AS series, offering a 500 × 400 mm PCB working area for larger boards and batch reflow without moving to an inline conveyor system.
Four automatic soldering modes come preset, with the ability to create a personalized temperature profile for your process.
The AS-6070 expands the tabletop reflow format to a 500 × 400 mm PCB working area. It is intended for users who need substantially more batch area than the smaller AS models while keeping a drawer-style reflow process.
The controller includes four preset automatic soldering modes and allows a custom profile to be created. The published process ranges support programmable preheat, soak and reflow stages up to 300°C.
Watch the AS-6070 in operation for a closer look at the large drawer area, controller and reflow process.
| Model | AS-6070 |
|---|---|
| Programmable profiles | 4 |
| PCB maximum working area | 500 × 400 mm |
| Maximum output power | 3,600 W |
| Voltage | 220 V |
| Maximum height | 25 mm |
| Preheat range | 70–150°C, 0–5 min |
| Soak range | Up to 250°C, 0–5 min |
| Reflow range | Up to 300°C, 0–30 sec |
| Working mode | Four automatic soldering modes preset; custom profile available |
Send us your PCB dimensions and solder paste requirements. We can help confirm whether the AS-6070 or an inline reflow oven is the better fit.
